The first Glass Core Substrate prototypes, featuring co-packaged optics, were pictured at OFC 2026, giving us a glimpse of future chips. First Glass Core Substrate Prototypes Surface at OFC 2026 With Co-Packaged Optics, Hinting at What 2029 AI Chips Will Look Like At the Optical Fiber Communication Conference 2026, Dr. Ian Cutress of More Than Moore spotted prototypes of a glass-core substrate-based chip with an AOP (Active Optical Package). These prototypes (mockups, as Dr. Ian puts it) are a showcase of what next-generation chips will look like. Glass Core substrates have been gaining interest, as they have several benefits over […]
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