Korean memory manufacturer SK hynix has announced a yield improvement for its hybrid bonding packaging technology for high bandwidth memory (HBM) modules. Hybrid bonding enables memory chip manufacturers to bond memory layers with each other without relying on bumps. The direct contact enables higher speeds and improved efficiency through lower heat generation. SK Hynix’s technical leader, Kim Jong-hoon, revealed the development at the Beyond HBM — Core Technologies of Advanced Packaging: From Next-Generation Substrates to Modules conference in South Korea, reports The Elec. Latest Packaging Technology To Come Into Play With Next-Generation HBM 4 Memory Chips High bandwidth memory is […]
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