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Intel Gives Rundown on 14A/18A Chips & Advanced Packaging Opportunities, Revealing Customer Commitments Expected to Flow In by H2 2026

Man speaking on stage with Siemens and foundry visible in the background.

Well, at Intel’s Q4 earnings call, CEO Lip-Bu Tan and CFO David Zinsner made several remarks suggesting that the foundry division is progressing with steady momentum. Intel Is Projecting “Billions in Revenue” From Chip & Advanced Packaging Commitments While at the consumer/DCAI front, Team Blue showed sluggish progress in maintaining a balance between the two businesses, but when it comes to how Intel Foundry is evolving, CEO Lip-Bu Tan gave us an extensive rundown of how nodes are progressing and customer sampling. Talking about the 18A and derivatives, Lip-Bu Tan revealed that the company is now moving towards supplying PDK […]

Read full article at https://wccftech.com/intel-gives-rundown-on-14a-18a-and-advanced-packaging-opportunities/