Intel’s plans to integrate glass substrates into advanced packaging technologies aren’t set to phase out just yet, as the company showcases a key innovation. Intel’s Newest EMIB + Glass Substrate Core Technology Allows a Multi-Chiplet GPU Configuration For Future HPC Chips When we talk about the future of advanced packaging, one key metric is the use of glass substrates to replace organic materials used in traditional implementations. We’ll talk about the benefits of glass substrates a bit later, but for now, Intel Foundry has showcased a “Thick Core” glass substrate integrated within their EMIB packaging technology at this year’s NEPCON […]
Read full article at https://wccftech.com/intel-showcases-glass-core-substrates-with-emib-advanced-packaging/