SK hynix, the renowned memory manufacturer, plans to take advanced packaging into its own hands, as the firm is reportedly looking to set up a 2.5D packaging facility in the US. SK Hynix Moves To Build 2.5D Packaging Lines in the US, Competing With TSMC in the Region Lack of advanced packaging lines is currently a significant concern for the resilience of the US supply chain, primarily because technology has evolved into an integral part of the computing world. Despite massive investments by companies like TSMC, there is no advanced packaging fab in the US that provides mainstream solutions like […]
Read full article at https://wccftech.com/sk-hynix-plans-to-make-a-surprise-move-into-us-advanced-packaging/