TSMC is now looking to convert a fab site in Arizona into an advanced packaging facility, as the firm witnesses massive demand for CoWoS from US clients. TSMC’s Advanced Packaging Plant Could Arrive In Arizona By The End of 2027 To Meet Customer Demand The need for advanced packaging has risen dramatically amongst AI GPU and ASIC manufacturers, mainly since it is one of the technologies through which AI performance has scaled tremendously. Companies like NVIDIA and AMD have shifted their focus towards producing in the US; however, the lack of advanced packaging facilities from TSMC in the nation ultimately […]
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