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Intel CFO ‘Doubles Down’ on 18A and 14A Progress; Says the Firm Now Has “Momentum” In Getting External Customers For Advanced Packaging

A person holding a semiconductor wafer stands in front of the Intel logo, wearing an 'Intel Foundry' vest.

Intel’s CFO, David Zinsner, has discussed the position of the firm’s foundry division, saying that there’s massive optimism with upcoming processes, as well as the current advanced packaging portfolio. Intel’s CFO Dismisses Concern Of a Foundry Spin-off, Driven By Interest Around Chips & Advanced Packaging Intel’s CFO was spotted talking at the UBS Global Technology and AI Conference, where he discussed the company’s progress with the upcoming 18A process. Intel is currently mass-producing Panther Lake chips, which are set for retail showcase by January 5. More importantly, the progress around yield rates of the 18A node is a key factor […]

Read full article at https://wccftech.com/intel-cfo-doubles-down-on-18a-and-14a-progress-says-the-firm-now-has-momentum-in-getting-external-customers-for-advanced-packaging/