Skip to content

Intel Teams Up With Amkor On ‘EMIB’ Advanced Packaging Technology, Outsourcing Production Amid Massive Interest From the AI Industry

Industrial facility with a large curved building, parking lot filled with small vehicles, and visible equipment on rooftops.

Intel’s advanced packaging services are gaining market spotlight, which is why Team Blue is now moving towards outsourcing production to companies like Amkor. Intel Plans to Produce EMIB Packaging In South Korea to Meet the Anticipated Demand Coming From AI Giants With NVIDIA’s ‘co-design’ laws in place, the demand for technologies like EMIB and CoWoS has increased exponentially, to the point where the supply chain cannot meet the capacity required by tech giants. We know that TSMC has been the dominant entity in the realm of packaging technologies, with solutions such as CoWoS; however, it appears that another player is […]

Read full article at https://wccftech.com/intel-teams-up-with-amkor-on-emib-advanced-packaging-technology/