Intel’s advanced packaging rumors continue to gain traction in recent days, as a new report reveals that the firm may receive orders from Google for future TPUs. Intel’s EMIB Technology Is Leading to Be a Primary Alternative to TSMC’s CoWoS, Attracting the Attention of ASICs When it comes to advanced packaging services, Intel Foundry has seen significant interest over the past few weeks, particularly since one of the biggest bottlenecks in the US chip supply chain is the lack of domestically available packaging facilities. It is rumored that Big Tech is looking to Intel for services like EMIB and Foveros packaging. According […]
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