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Intel Is Reported to Secure Microsoft, Tesla, Qualcomm & NVIDIA as Advanced Packaging Customers in the U.S., Led by Its Newly Hired Ex-TSMC Executive

Industrial facility with a large curved building, parking lot filled with small vehicles, and visible equipment on rooftops.

It appears that the advanced packaging services are starting to emerge as a ‘massive prospect’ for Intel Foundry, as they manage to receive attention from several US customers who have placed chip orders at TSMC Arizona. TSMC Arizona Customers Are Looking Towards Intel For Advanced Packaging Services, Opening Up a New Prospect for the IFS For those unaware, the US is pursuing an independent supply chain, which involves setting up all stages of manufacturing, including semiconductor R&D, volume manufacturing, and advanced packaging. The nation has been successful in producing processes onshore; however, it currently has few options for packaging. It […]

Read full article at https://wccftech.com/intel-is-reported-to-secure-microsoft-tesla-qualcomm-nvidia-as-advanced-packaging-customers/