Intel might have been lagging significantly behind in the chip business, but when it comes to advanced packaging, the firm has competitive options. Intel’s EMIB & Foveros Advanced Packaging Solutions Are Seen as a Viable Alternative To TSMC’s Offerings Ever since high-performance computing became the norm in the industry, the demand for robust compute solutions has increased at a pace that surpasses the improvements brought about by relying solely on Moore’s Law. But, to meet the industry’s demand, manufacturers like AMD and NVIDIA adopted advanced packaging technologies, which essentially brought in ‘multiple chips’ in a single package, boosting chip densities […]
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