Intel researchers have found a way to simplify head spreader assembly, enabling cost-effective & better designs for “extra-large” advanced packaging chips. Intel Next-Gen Heatspreader Solution Paves The Way For “Extra-Large” Advanced Packages, Better Thermal & Value Proposition For Big Chips Intel Foundry researchers have published a new research paper titled “A Novel Disaggregated Approach of Assembling Integrated Heat Spreader for Advanced Packages”. In this paper, Intel states that engineers at their Foundry have researched a new disaggregated approach to heat spreaders, not just allowing better value and ease of manufacturing, but also delivering better cooling for high-power chips. This new […]
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